CFD Approach for Thermal Management to Enhance the Reliability of IC Chips

Anant Sidhappa Kurhade; G. Murali; T. Venkateswara Rao

doi:https://doi.org/10.14445/22315381/IJETT-V71I3P208

Research Article | Open Access | Download PDF

Volume 71 | Issue 3 | Year 2023 | Article Id. IJETT-V71I3P208 | DOI : https://doi.org/10.14445/22315381/IJETT-V71I3P208

CFD Approach for Thermal Management to Enhance the Reliability of IC Chips

Anant Sidhappa Kurhade, G. Murali, T. Venkateswara Rao

Received	Revised	Accepted	Published
25 Dec 2022	13 Feb 2023	17 Feb 2023	25 Mar 2023

Citation :

Anant Sidhappa Kurhade, G. Murali, T. Venkateswara Rao, "CFD Approach for Thermal Management to Enhance the Reliability of IC Chips," International Journal of Engineering Trends and Technology (IJETT), vol. 71, no. 3, pp. 65-72, 2023. Crossref, https://doi.org/10.14445/22315381/IJETT-V71I3P208

Abstract

The current study validates numerical studies on heat management of a single IC chip put on a circuit board. In the design that has been proposed, PCM is placed inside a narrow channel that is located on the outside of IC chips. The substrate board directly conducts latent heat to the PCM. This causes the material to change its phase, which enables the system to have high thermal cooling performance. The present study creates a comparative analysis between not having any PCM, having mini channels connected together, and having a single mini channel optimized near a heat source. According to the findings, the cooling capabilities of N-Eicosane are superior to those of paraffin wax, ATP 78 PCM, and N-Eicosane, respectively.

Keywords

CFD, IC chips, Minichannel, PCM, Thermal control.

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